I. Lub ntsiab txhais thiab lub hauv paus ntsiab lus ntawm Wave Soldering
Wave soldering yog cov txheej txheem tsis siv neeg uas txau cov molten solder (tam sim no lub ntsiab yog cov hlau lead- dawb solder SAC305) rau hauv nthwv dej los ntawm lub tshuab hluav taws xob nthwv dej. Lub rooj tsavxwm PCB dhau los ntawm nthwv dej ntawm ib lub kaum ntse ntse thiab nrawm, thiab cov pob qij txha ruaj khov yog tsim los ntawm cov pins thiab cov ntaub qhwv los ntawm kev ua haujlwm capillary thiab cov tshuaj tiv thaiv metallurgical. Lub hauv paus ntsiab lus tseem ceeb yog "kev sib cuag-infiltration-bonding". Cov nthwv dej feem ntau yog muab faib ua cov nthwv dej tsis muaj zog (tiv thaiv kev ploj ploj) thiab laminar tsis (ua kom tiav cov pob qij txha), uas koom tes nrog cov flux (qhov tseem ceeb tsis muaj- hom huv) kom ua tiav deoxidation thiab pab infiltration.
II. Ua tiav txheej txheem khiav ntawm PCBA Wave Soldering
Wave soldering yog ib txoj kab sib dhos ua haujlwm, thiab cov txheej txheem tseem ceeb tuaj yeem yooj yim rau hauv 7 kauj ruam. Qhov tsis sib xws ntawm txhua qhov txuas ncaj qha cuam tshuam rau qhov zoo ntawm soldering:
(1) Kev npaj PCB thiab cov khoom sib txuas
Ua kom tiav PCB preprocessing thiab THT tivthaiv insertion. Rau kev sib xyaw ua ke, SMT soldering yuav tsum ua kom tiav ua ntej, thiab cov khoom tuaj yeem kho nrog kua nplaum yog tias tsim nyog.
(2) Flux Application
Siv cov flux sib npaug ntawm PCB soldering nto los ntawm kev txau lossis lwm txoj hauv kev. Nws cov haujlwm tseem ceeb yog deoxidation, pab infiltration thiab tiv thaiv reoxidation, thiab daim ntawv thov nyiaj yuav tsum raug tswj kom meej.
(3) Preheating
Siv infrared lossis cua kub cua sov kom sib npaug ntawm PCB thiab cov khoom siv (90℃-130 degree), qhib cov flux, evaporate cov kuab tshuaj, thiab txo cov thermal shock.
(4) Wave Soldering
Raws li cov tub ntxhais txuas, lub molten solder yog rhuab mus rau 250℃-270 degree, thiab PCB dhau los ntawm nthwv dej ntawm lub kaum sab xis ntawm 5℃-7℃nrog lub sijhawm sib cuag ntawm 2-6 vib nas this. Ob chav nthwv dej yog tsim rau cov PCBs nyuaj.
(5) Cua txias
Kev ua kom txias sai sai los ntawm kev quab yuam cua txias lossis dej txias kom ruaj khov, tsis txhob muaj qhov tsis xws luag, thiab xyuas kom lub zog sib koom ua ke thiab PCB flatness.
(6) Pin txiav thiab tu
Trim tus pins protruding thiab ntxuav lub solder dross thiab flux residues. Kev ntxuav tuaj yeem raug tshem tawm yog tias tsis muaj - cov dej huv huv raws li tus qauv.
(7) Kev tshuaj xyuas thiab kov -Tau Soldering
Txheeb xyuas qhov tsis xws luag xws li cov pob qij txha txias thiab kev sib txuas, kov cov pob qij txha tsis tsim nyog, thiab cov khoom tsim nyog nkag mus rau qhov txuas txuas ntxiv.
III. Common Defects thiab Countermeasures
Cov kev tsis xws luag ntawm yoj soldering thiab yooj yim countermeasures: 1. Cold solder joint: Optimize preheating thiab soldering kub, kho lub conveyor ceev; 2. Kev sib txuas: Txo qhov kub thiab txias thiab ua raws li kev thov flux; 3. Solder spike: Tswj kub thiab ntxuav lub lauj kaub tais diav impurities; 4. Solder pob: Txhim kho cov txheej txheem flux thiab ua kom qhov kub thiab txias.
IV. Daim ntawv thov tus nqi thiab kev loj hlob Trend
Tus nqi tseem ceeb ntawm yoj soldering lies nyob rau hauv high efficiency, ruaj khov zoo thiab tswj tus nqi, uas yog haum rau loj ntau lawm. Nyob rau hauv lub neej yav tom ntej, nws yuav hloov mus rau kev coj - dawb thiab txawj ntse. Qhov ob -nthwv dej thiab triple-wave technologies yuav raug txhim kho tsis tu ncua kom hloov mus rau cov kev xav tau ntawm cov khoom siv hluav taws xob siab ntawm -cov PCBs ceev thiab pab txhim kho kev lag luam hluav taws xob.
