Ntawm txoj hauv kev mus rau cov miniaturizing eleciaturics, qhov loj ntawm PCBA (luam tawm Circuit Court board sib dhos) yeej ib txwm yog ib tug bottleneck. Tsoos PCBAS pcbas mount ntau daim chips thiab cov khoom sib cais rau hauv ib lub rooj tsavxwm, ua rau nws nyuaj kom ua tiav qhov kev txo qis.
Tam sim no, system - hauv - pob (SIP) yog tawm los ntawm kev sib tawg. Tsis zoo li cov pcbas ib txwm muaj, SIP ncaj qha ntau daim chips nrog cov haujlwm sib txawv (xws li cov khoom lag luam sib txawv) nrog rau passive Cheebtsam rau hauv ib qho module. Qhov no yog zoo li condensing tag nrho cov boardracter board rau hauv ib "super nti."
Nyob rau hauv txoj kev no, sip thev naus laus zis tuaj yeem sib xyaw ua haujlwm Circuit Court ua haujlwm rau qhov chaw me me, zoo heev txo qhov loj thiab qhov hnyav ntawm cov khoom kawg. It is not just the next step in the "system-on-chip" concept, but also the key to creating the next generation of ultra-small, high-performance electronic devices.
