Kev faib tawm PCBA paug
◼PLANGANTS
a. Flux activator (organic acid, ethanolamine, thiab lwm yam);
b. Tawm hws, ntiv tes;
c. Solder dross;
d. Nta oxide ntawm cov khoom sib xyaw thiab PCB.
◼ Tsis yog-polar paug
a. Rosin thiab resin seem nyob rau hauv flux;
b. Kev kub siab kab xev thiab cov nplaum nplaum.
C.skin khau ntiv tes;
d. Anti-oxidation roj, thiab lwm yam.
◼ Particle Particants
a. Hmoov av, haus luam yeeb, lint, thiab lwm yam;
b. Cov hlaws dai nplua thiab Tin slag;
C.EECTrostatic hais;
d. Cov iav fibers tsim thaum lub sijhawm drilling thiab punching ua haujlwm.
Raug PCBA Tu Txheej Txheem
1. Hnyav tu
▪, hydrocarbons, dej cawv, ketones, fluorine uas muaj kuab tshuaj, lub plab zom zaws thiab lwm cov kuab tshuaj sib xyaw;
Cov khoom siv hluav taws xob muaj hluav taws xob, tawg tau rau ib puag ncig, thiab muaj kev phom sij rau tib neeg lub cev.
2. Kev daws teeb meem ib nrab
▪organic kuab tshuaj ntxuav + dej yaug;
▪Mus organic cov kuab tshuaj muaj qee cov nplaim frammability thiab volatility.
3. Dej-ntxuav
▪Water-based cleaning + water rinsing
