1. OVERVIEW NTAWM HDI PCBA
High-density interconnect (HDI) PCB yog ib qho microvias advertilias, zoo nkauj, thiab siab dua interlayer kev twb kev txuas ntom ntom ntom. Nws yog dav siv nyob rau hauv smartphones, 5G kev sib txuas lus, cov cuab yeej kho mob, cov khoom siv kho tsheb, thiab lwm thaj chaw. Piv rau cov tsoos pcbs, HDI PCBA muaj me me, lub cim kev ncaj ncees ntau dua, thiab ua tau zoo dua qub. Txawm li cas los xij, nws cov kev tsim thiab cov txheej txheem sib dhos tseem muaj cov kev sib tw tseem ceeb.
2. Cov nyom ntawm HDI PCBA
(1) teeb meem nyob rau hauv cov kab zoo thiab Microvia ua
• Cov nyom:
o Lw dav \/ txuas (L \/ S) yog feem ntau tsawg dua los yog sib npaug ntawm 75μm, ua ib txwm etching nquag qhib lossis luv luv voj voog.
o Laser Drilling (piv txwv li, dig muag \/ faus vias \/ faus vias) yuav tsum muaj qhov tseeb (ntawm txoj kab uas hla mus rau 100μm), thiab kev tsis zoo siab tuaj yeem cuam tshuam rau cov paib kev sib kis.
Kev daws teeb meem:
O Siv Laser ncaj qha kev yees duab (LDI) thev naus laus zis txhawm rau txhim kho LEAP qhov tseeb.
o Ua haujlwm siab-precision co₂ \/ UV laser drilling machine nrog oi tshuaj xyuas kom muaj kev ua kom yog qhov chaw ua haujlwm.
(2) Txheej polignment thiab pawg-up complexity
• Cov nyom:
O Multiilayer HDI laug cam (piv txwv li, ib txheej txheej sib cuam tshuam) xav tau nruj me ntsis; Lamination misalignment tuaj yeem ua rau cov teeb meem tsis sib haum.
O hybrid cov ntaub ntawv (piv txwv li, PTFE nrog FR4) yuav raug kev txom nyem los ntawm kev txiav txim siab.
Kev daws teeb meem:
o Siv cov xoo hluav taws xob xoo ib qib nruab nrab thiab kev them nyiaj kho mob.
o Siv qis-shrinkage substrates thiab lub tshuab nqus tsev Lamination ua los txo kev kub siab.
(3) soldering txheej txheem thiab kev ntseeg tau teeb meem
• Cov nyom:
o Miniaturized BGA thiab CSP pob (suab tsawg dua lossis sib npaug nrog 0. 4mm) yog nquag los siv cov vov thiab bridging.
o Kev tsis ncaj ncees ua cua sov tsis txaus ntseeg hauv cov khoom siv hluav taws xob siab yuav ua rau cov kev ntxhov siab thermal.
Kev daws teeb meem:
o Txhim kho cov solder muab tshuaj txhuam cev luam ntawv (stencil tsim qauv (stencil tsim, theem stencils).
o Siv cov nitrogen xav tau soldering soldering kom txo qis oxidation thiab txhim kho cov paib.
o Ua kev tshawb xyuas thermal simulation kom pom zoo kom kho cua sov dissipation (piv txwv li, ntxiv thermal vias).
(4) kev sim thiab kuaj xyuas cov teeb meem
• Cov nyom:
o Microvias thiab faus vias yog qhov nyuaj los sim nrog cov txheej txheem tsis muaj cai.
O high-density layouts nce AOI tsis tseeb-tus nqi.
Kev daws teeb meem:
o Txais 3D xoo hluav taws xob tshuaj xyuas los ntsuas kev ua tau zoo sab hauv zoo.
o Muab cov kev sojntsuam ya mus kuaj thiab ciam teb scan (JTAG) rau kev pab them nqi siab dua.
3. Yav dhau los hauv HDI PCBA
1. Me me trace dav|vias: tsiv mus rau 30μm \/ 50μm cov txheej txheem rau ultra-nyias.
2. Cov khoom lag luam tsim hluav taws xob: cov khoom siv tsis muaj zog (piv txwv li, m7ne) rau kev txhim kho kev ua tau zoo.
3. Qhov ntse tsim: ai-tsav txheej txheem kev ua kom ua kom zoo thiab kev ua ntej tsis txaus.
4. Heterogeneous Kev sib xyaw ua ke: sib txuas nrog SIP (system-in-pob) rau kev ua haujlwm nrawm dua.
4. Xaus
Hdi PCBA yog qhov tseem ceeb thev naus laus zis rau kev sib tw hauv kev sib tw, tab sis nws cov kev tsim khoom muaj kev sib tw, thiab kev saib xyuas kev ntseeg tau, thiab tshuaj xyuas kev sib cav sib ceg, thiab tshuaj xyuas kev nyuaj. Los ntawm kev siv cov txheej txheem advanced adved (LDI, laser drilling), cov khoom siv zoo, thiab kev ua kom ntse thiab muaj kev ntseeg tau zoo. Nrog kev thov cog qoob loo los ntawm 5G, aniot, thiab cov tshuab HDI yuav txuas ntxiv mus ua ciam teb.
