Ib qho ntawm feem ntau siv nto finishes yogHASL (Huab Cua Kub Solder Leveling), muaj nyob rau hauv ob qho tib si leaded thiab lead - dawb versions. HASL muaj qhov zoo tshaj plaws solderability thiab tus nqi qis, tab sis nws qhov chaw tsis sib xws ua rau nws tsis haum rau kev nplua -pitch Cheebtsam thiab siab -PCBs ceev.
ENIG (Electroless Nickel Immersion Kub)yog nyiam rau siab - daim ntawv thov kev ntseeg siab. Nws muab lub tiaj tus, oxidation- tiv taus nto thiab ua tau zoo heev nrog BGA, QFN, thiab CSP pob. Txawm hais tias kim dua HASL thiab OSP, nws qhov ruaj khov ua rau nws zoo tagnrho rau cov servers, cov khoom siv sib txuas lus, thiab cov khoom siv hluav taws xob zoo.
OSP (Organic Solderability Preservatives)yog tus nqi -kev xaiv zoo thiab tus phooj ywg ib puag ncig. Nws tsim ib zaj duab xis nyias nyias los tiv thaiv tooj liab los ntawm oxidation. OSP muab qhov chaw tiaj tus heev tab sis muaj qhov txwv lub neej txee thiab yog qhov zoo tshaj plaws rau cov txheej txheem reflow ib zaug lossis tsawg, feem ntau siv hauv pawg- tsim khoom siv hluav taws xob.
Immersion Nyiajmuaj cov conductivity zoo heev thiab solderability, ua rau nws haum rau siab - zaus los yog RF daim ntaub ntawv. Txawm li cas los xij, nws yuav tsum tau tswj xyuas cov xwm txheej kom tsis txhob muaj tarnishing.Immersion Tinxa cov flatness zoo tab sis nws yooj yim rau tin whiskers, txwv nws siv nyob rau hauv siab -cov khoom ntseeg tau.
Rau kev ua tau zoo tshaj plaws,ENEPIG (Electroless Nickel Electroless Palladium Immersion Kub)muab kev ntseeg tau tshwj xeeb thiab txhawb kev sib txuas xov hlau. Nws tshem tawm txoj kev pheej hmoo ntawm cov ntaub qhwv dub thiab tau siv dav hauv cov khoom siv hluav taws xob hauv tsheb, kev tswj hwm kev lag luam, thiab cov khoom siv kho mob.
Zuag qhia tag nrho, xaiv qhov zoo saum npoo tiav yog qhov tseem ceeb rau kev ua tiav cov khoom lag luam siab, kev ua kom zoo tshaj plaws, thiab ntev -PCBA kev ntseeg tau.
